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Zhong Lun Advises on Issuance of 2011 Shanghai Yangpu SME Collective Bond
Zhong Lun Advises on Issuance of 2011 Shanghai Yangpu SME Collective Bond
On January 19, 2011, the 2011 Shanghai Yangpu Small and Medium Enterprises Collective Bond (Abbr.: 11 Yangpu SMECN1, the “Collective Bond") was successfully issued in the National Inter-bank bond Market. The Collective Bond is a 3-year bill with the issuance amount of RMB335,000,000, and interest rate at 5.40% p.a.
The issuers of the Collective Bond are Shanghai TJ Innova Engineering & Technology Co., Ltd., Shanghai International Enterprises Human Resources Consulting Co., Ltd., Shanghai Yangpu Science & Technology Innovation Center Co., Ltd., Shanghai Fudan Techsun New Technology Co., Ltd., Shanghai Yangpu Science & Technology Investment Development Co., Ltd. and Shanghai New Shanghua Polymer Material Co., Ltd.
Zhong Lun was engaged to act as legal counsel of the issuers. Partner Ge Yongbin led the legal service team which also comprised Fu Qiang, Dong Jianping and Lou Jun.
Bank of Shanghai was the underwriter and bookrunner of the Collective Bond. Shanghai Brilliance Credit Rating & Investors Service Co., Ltd. was the credit rating institution. China National Investment & Guaranty Co., Ltd provided irrevocable joint and several guarantee. Shanghai Re-Guarantee Co., Ltd. provided counter-guarantee.
